‘NST’ Series Vacuum Plasma Surface Treatment Equipment
₹ 8,000,000.00 ₹ 8,500,000.00
Product Introduction
‘NST’ VACUUM PLASMA TREATMENT EQUIPMENT IS SUITABLE FOR PRODUCT SURFACE PURIFICATION, ACTIVATION, COARSENING, ETCHING AND GRAFTING, AND CAN BE USED TO TREAT A VARIETY OF MATERIALS, INCLUDING METALS, SEMICONDUCTORS, POLYMERS, COMPOSITES, CERAMICS AND GLASS.
FEATURES:
| 1 | Environmental technologies: | plasma process is the role of gas – solid coherent reactor, consumes no water resources, no need to add chemicals and no environmental pollution. |
| 2 | Wide adaptability: | regardless of processing substrate type, such as metals, Semiconductors, oxides, and most of the polymer material can be a good deal. |
| 3 | Low temperature: | close to room temperature, particularly suitable polymer materials, have a longer retention time and a higher surface tension than the corona and flame method. |
| 4 | Multifunction: | it involves only a shallow surface of polymer materials (10 -1000A), while preserving the characteristics of the material itself can give it one or more new features. |
| 5 | Low cost: | the device is simple, easy in operation and maintenance free, continuous operation, a few bottles of gas can replace thousands of kilograms cleaning fluid. |
| 6 | The whole process technology can be controlled | all the parameters can be set on the touch screen and data recording. |
| 7 | Treated geometry Unlimited: | Big or small, simple or complex, parts or textiles can be processed. |
ADVANTAGES
PLC control system;
Suitable for 3D work pieces with complex structure;
Does not change the inherent characteristics of the body, the modification only occurs on the surface;
Whole process dry treatment, no pollution;
Low temperature treatment, suitable for heat sensitive materials; High stability, long service life;
Low energy consumption, low maintenance costs.
PRODUCT APPLICATION
 Semiconductor |
 Optical glass |
 Biomedical |
 Mobile phone industry |
Product parameter
SUPPLY AND DEMAND
POWER SUPPLY: 380V/50HZ, THREE-PHASE, 15A;
PROCESS GAS: INPUT PRESSURE 0.2MPA;
COMPRESSED AIR: INPUT PRESSURE 0.6MPA
OPTIONAL CONFIGURATION
RF GENERATOR; CIRCULATING WATER COOLER;
VACUUM CHAMBER SIZE (CUSTOMIZABLE);
MFC RESISTANT TO CORROSIVE GASES.
| Technical configuration | NST-80 | NST-110 | NST-150 |
| Overall Dimension | 1050×1020×1750mm | ||
| Reaction cavity size (WxHxD) | 450 × 400 × 450 mm | 400 x 400 x 600 mm | 530 x520 x 560 mm |
| Effective size of bracket | 320x400mm | 380×480mm | 480×390 mm |
| Vacuum chamber material | Stainless Steel (SS-316) | ||
| Formation | Flat horizontal trays/ vertical trays/ rotary drum | ||
| Vacuum pump | Bipolar oil pump | ||
| Pumping Speed | 40 m3/hr | ||
| Flapper valve | Ultra-high vacuum KF40 | ||
| Mass flow controller | 0-500 Sccm (optional)
Resolution: 0.1% of full scale, Repeatability: +/-0.3% of reading Leak rate: <0.1% of full scale |
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| Vacuum gauge | ULVAC | ||
| Radio frequency power supply | 40KHz/ 13.56 MHZ (optional) | ||
| Power | 0-1000W, continuously variable output | ||
| PLC system | Siemens | ||
| Electrical system | Schneider | ||
| Touch screen | 10.7 inch | ||
| Water cooling system | Assorting | ||
| Treatment gas | O2 、Ar 、N2 、 H2、 CF4、CDA | ||
| Gas connection | 6 mm inlet | ||
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