Product Introduction
‘NST’ VACUUM PLASMA TREATMENT EQUIPMENT IS SUITABLE FOR PRODUCT SURFACE PURIFICATION, ACTIVATION, COARSENING, ETCHING AND GRAFTING, AND CAN BE USED TO TREAT A VARIETY OF MATERIALS, INCLUDING METALS, SEMICONDUCTORS, POLYMERS, COMPOSITES, CERAMICS AND GLASS.
FEATURES:
| 1 | Environmental technologies: | plasma process is the role of gas – solid coherent reactor, consumes no water resources, no need to add chemicals and no environmental pollution. |
| 2 | Wide adaptability: | regardless of processing substrate type, such as metals, Semiconductors, oxides, and most of the polymer material can be a good deal. |
| 3 | Low temperature: | close to room temperature, particularly suitable polymer materials, have a longer retention time and a higher surface tension than the corona and flame method. |
| 4 | Multifunction: | it involves only a shallow surface of polymer materials (10 -1000A), while preserving the characteristics of the material itself can give it one or more new features. |
| 5 | Low cost: | the device is simple, easy in operation and maintenance free, continuous operation, a few bottles of gas can replace thousands of kilograms cleaning fluid. |
| 6 | The whole process technology can be controlled | all the parameters can be set on the touch screen and data recording. |
| 7 | Treated geometry Unlimited: | Big or small, simple or complex, parts or textiles can be processed. |
ADVANTAGES
PLC control system;
Suitable for 3D work pieces with complex structure;
Does not change the inherent characteristics of the body, the modification only occurs on the surface;
Whole process dry treatment, no pollution;
Low temperature treatment, suitable for heat sensitive materials; High stability, long service life;
Low energy consumption, low maintenance costs.
PRODUCT APPLICATION
Semiconductor |
Optical glass |
Biomedical |
Mobile phone industry |
Product parameter
SUPPLY AND DEMAND
POWER SUPPLY: 380V/50HZ, THREE-PHASE, 15A;
PROCESS GAS: INPUT PRESSURE 0.2MPA;
COMPRESSED AIR: INPUT PRESSURE 0.6MPA
OPTIONAL CONFIGURATION
RF GENERATOR; CIRCULATING WATER COOLER;
VACUUM CHAMBER SIZE (CUSTOMIZABLE);
MFC RESISTANT TO CORROSIVE GASES.
| Model | NST-20D | NST-35D | NST-60D | NST-100D | NST-300D | |
| Spec. | Machine dimension (mm) | 650*800*1750 | 650*800*1750 | 750*800*1750 | 750*800*1750 | 1500*1300*1750 |
| Weight (KG) | 200 | 220 | 260 | 260 | 560 | |
| Plasma Chamber | Chamber dimension (mm) | 260*260*300 | 300*300*400 | 400*400*400 | 400*500*500 | 700*600*800 |
| Capacity (L) | 20 | 35 | 60 | 100 | 300 | |
| Chamber Material | Stainless Steel / Aviation Aluminum | |||||
| Plasma power | High frequence (40KHz) | 500W | 500W | 1000W | 1500W | 5KW / 10KW |
| Radio Frequency (13.56MHz) | 300W | 300W | 500W | 500W / 1000W | 2000W | |
|
Control system |
Working mode | Manual / automatic | ||||
| Control mode | PLC+HMI | |||||
| Touch screen | 10” | 14” | ||||
|
Gas system |
Gas channel | 2-4 ways | ||||
| Flow range | 0-200sccm / 0-500sccm option | |||||
| Flow meter | 2-4pcs mass flow Controller (MFC) | |||||
| Gas interface | Hose (6mm outer diameter) | |||||
| Gas pressure | 0.1-0.2MPa | |||||
| Process gas | Oxygen, nitrogen, argon, hydrogen or mixed gas, etc. | |||||
|
Pallet |
Size (mm) | 225*255 | 265*355 | 365*355 | 365*455 | 665*750 |
| Number of layers | 2-4 layer | 2-4 layer | 3-6 layer | 3-7 layer | 6-10 layer | |
| Material | 304 stainless steel (sandblasting + electropolishing) | |||||
|
Vacuum system |
Pumping speed | 16m3/h | 30m3/h | 60+280m3/h | ||
| Ultimate vacuum degree | below 10Pa | |||||
| Vacuum pump | Oil pump / dry pump (origin and brand optional) | |||||
| Range (pa) | 1×10-2-1×105 | |||||









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