NST Vacuum magnetron sputtering system is used for the preparation of novel thin film materials such as nanometer single-layer and multi-layer functional film, hard film, metal film, semiconductor film and dielectric film. It can be widely used in the research and production of thin film materials in colleges and universities.
Vacuum magnetron sputtering system specifications:
|Vacuum chamber||Cylindrical front opening structure, size Ø450×40mm|
|Vacuum system configuraition||Compound molecular pump, mechanical pump, pneumatic gate valve, imported SMC cylinder throttle valve|
|Ultimate pressure||≤6.6*10-6 Pa(after baking and degassing)|
|Vacuum recovery system||It can reach 6.6×10-4pa in 25 minutes(start pumping after short exposure to air and filled with dry helium)|
|Magnetron target unit||Three sets of permanent magnetic target; target sizeØ60mm(one of those can be used for sputtering ferromagnetism materials )；Each target rf sputtering is compatible with dc sputtering.Water cooling within the target; The sample centers of the three targets can fold upward together. The distance between target and sample is adjustable from 90 to 130mm. Each target is equipped with imported SMC rotary pneumatic baffle|
|Single substrate heating table||Sample size||Ø4 inches|
|Mode of motion||Substrate rotates continuously, rotation speed 0-30 rpm|
|Heating||Heated by imported heating wire, max heating temperature 600℃±1℃|
|Battle format||Imported SMC angle air cylinder control|
|Gas circuit system||2-circuit mass flow controller|
|Computer control system||Fully automated control by PLC+IPC+touch screen|
|Optional accessories||Film thickness gauge, air pump, cooling water circulator|
|Space occupied||Main unit||1000×1800mm2|
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