High vacuum magnetron sputtering coater is used for the preparation of novel thin film materials such as nanometer single-layer and multi-layer functional film, hard film, metal film, semiconductor film and dielectric film. It can be widely used in the research of thin film materials and the production of small batch. It can be widely used in universities and colleges, scientific research institutes of thin film materials preparation research and small batch.
High vacuum magnetron sputtering coater specifications:
|Vacuum chamber||Piriform vacuum chamber, size: Ø450×350mm|
|Vacuum system configuration||Compound molecular pump, mechanical pump, gate valve|
|ultimate pressure||≤2.0*10-5Pa(After baking degassing)|
|Vacuum recovery time||Up to 6.6*10-4Pa in 40 minutes. (the system briefly exposes the atmosphere and fills with dry nitrogen to start pumping)|
|Magnetron target component||5 sets of permanent magnetic targets; target sizeØ60mm(one of the targets can sputtering ferromagnetic material). The RF beach and DC cutoff of each target are compatible.; and the distance between target and sample is adjustable from 90mm to 130mm.|
|Water-cooling Substrate Heating Revolution Table||Substrate structure||Six stations, heating furnace installed at one of these stations, and the others are water cooling substrate station.|
|Sample size||Ø30mm, 6 pieces can be placed|
|Mode of motion||0~360℃, reciprocating rotary|
|Heating||Max. Temperature 600℃±1℃|
|Substrate Negative Bias||-200V|
|Gas Circuit System||2-circuit mass flow controller|
|Computer Control System||Control sample rotation, baffle switch, target identification, etc|
|Space Occupied||Main Set||1300×800mm2|
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