Voltage |
- AC 110V or AC 220V +/- 10%
- (please select and highlight the working voltage for cutting saw and vacuum pump in your requirement.)
|
Motor |
Brushless magnetic DC motor (110V) with variable speed up to 3,000 rpm.
Power consumption: 180W |
Effective Cutting Range |
3 dimension: X-axis: 8″ Y-axis:4″ Z-axis:4″ |
Moving/Cutting Speed Range |
X-axis: 1-50mm/min adjustable
Y-axis: 1-50mm/min adjustable
Z-axis: 1-20mm/min adjustable |
Accuracy |
0.0025 mm moving resolution and 0.01 mm position accuracy. |
Cutting Blades Kits |
- One 4″ Dia x, 0.35 mm thick fully sintered diamond blade
- Two pairs of flanges with 62 mm Dia. ( for dicing ) and 42 mm Dia. (for deep cutting)
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PC Software
 |
- Laptop and PC software is provided with the equipment.
- Cutting parameters can be set in software as cutting length, width, diameter, time, feed speed, kerf loss, etc
- Manual or programmable control mode
- compatible with Win 7/8/8.1
- Click the pic below to view the software interface.
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Water Cooling |
- Assemblies of water jetting, draining, and Transparent plastic splashing protection is included.
- The optional EQ-ECO-430 Coolant Circulating Tank is NOT included in the standard package. Please click the link to order if needed.
- Adjustable nozzles are installed for re-circulating coolant
- Protective splash cover with elect cooling during tonic safety interlock installed.
- For better lighting, please consider a Fiber Optic Y-shape Dual Light Microscope Illuminator

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Accessories
 |
- Complete accessories are included for immediate use, including 120L/min Oilless vacuum pump,
4″ diamond blade and sample holder.etc. Please see below standard package for details
- One vacuum chuck (P/N ECO402) and adhesive film (P/N ECO 419).are included for dicing the thin wafer.
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Optional |
- For extend cutting wire service life, please use LubeCool -150 Smart Solid Lubricant and Coolant
- In order to ensure accurate alignment when cutting the wafer, consider 25x stereo microscope with the support frame
- For dicing Si, Ge, GaAs and quartz, LiNbO3 wafers, you may consider using 100 microns ultra-thin diamond blade because of fewer kerfs.
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Net WT& DIMEN |
- Net Weight: 33.5 kg
- 580 L x 560 W x 660 H (mm)
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Shipping WT & DIMEN |
- Shipping weight: 190 lbs
- 48″L x 40″W x 37″H (inch)
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Warranty & Compliance |
One year limited with lifetime support —but not including damages caused by misuses, such as rusted part from inadequate storage and broken parts by the user. |
Certification |
CE certified. With additional certification fee, MTI can arrange NRTL to perform UL/CSA inspection and label the machine per customer’s request. |
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