Single chamber magnetron sputtering system is mainly composed of sputtering vacuum chamber, magnetron sputtering target, substrate water-cooled heating platform, working gas path, air extraction system, vacuum measurement, electronic control system and installation machine.
Dual-target NST magnetron sputtering coater is a cost-effective magnetron sputtering coating equipment independently developed by our company. It is standardized, modular and customizable. There are 1-inch or 2-inch magnetron targets for you to choose. Customers can choose the target according to the size of the substrate to be coated.
NST Four sources thermal evaporating system is a compact thermal evaporating system with total 4 evaporating source crucibles and precision and programmable temperature control. Four evaporating crucibles could be used to deposit multiple different materials to grow multilayers films one by one in the same chamber.
NST-5-inch close-range rotary evaporation coating furnace is specifically designed for thermal evaporation or CSS (Close Spaced Sublimation) coating experiments.Its coating area can reach 5″×5″, and the top sample stage can be rotated to improve coating uniformity.
NST-in-line magnetron sputtering system is used to deposit metal film (Al, Ag, Ni, Cu, Ti, Pd, etc.) on the surface of crystal silicon, and can realize reactive sputtering. It can complete magnetron sputtering process under high and low vacuum, and also has the ability to produce crystalline silicon photovoltaic film in various sizes and larg.
Dual-Target Magnetron Sputtering Coater 
Single-target NST magnetron sputtering coater NST-MSP300S-NST 
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