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NST-3 heads compact RF plasma magnetron sputtering coater

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NST 3 heads compact RF plasma magnetron sputtering coater is designed for non-metallic thin film coating, mainly for multilayer oxide thin films.DC magnetron sputtering option is available upon request for metallic film deposition, enabling three DC, one RF/two DC, and two RF/one DC sputtering head configurations.

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TECHNICAL PARAMETER

NST 3 heads compact RF plasma magnetron sputtering coater is mainly used to make non-conductive films, especially some oxide films.It is the most cost-effective coater for researching in the new generation of oxide thin films.

NST 3 heads compact RF plasma magnetron sputtering coater specifications:

Input Power
  • Single phase 220 VAC, 50 / 60 Hz
  • 1000 W (including vacuum pump and water chiller)
  • If the voltage is 110 V, a 1500 W transformer can be ordered at our company
Power Source
  • 13.5 MHz, 100 W RF generator with manual matching is included and connected to the sputtering heads
  • Load range: 0 – 80 Ω adjustable. Tuning range: -200j – 200j adjustable
  • The rotatable switch can activate one sputtering head at a time. Sputtering heads can be switched “in the plasma” (no breaking of vacuum and plasma during a multilayer process)
  • With a DC power supply, the coater can be easily modified into 1” DC sputtering sources for metallic film deposition, enabling three DC, one RF / two DC, and two RF / one DC sputtering head configurations
Magnetron Sputtering Head
  • Three 1″ magnetron sputtering heads with water cooling jackets are included and inserted into quartz chamber via quick clamps
  • One manually operated shutter is built on the flange
  • One 10 L/min digitally controlled recirculating water chiller is included for cooling sputtering heads
Sputtering Target
  • Target size requirement: 1″ diameter×1/8″ thickness max
  • Sputtering distance range: 50 – 80 mm adjustable
  • Sputtering angle range: 0 – 25° adjustable
  • 1″ diameter Cu target and Al2O3 target are included for demo testing
Vacuum Chamber
  • Vacuum chamber: 256 mm OD×238 mm ID×276 mm Height, made of high purity quartz
  • Sealing flange: 274 mm Dia. made of Aluminum with high-temperature silicone O-ring
  • Stainless steel shield cage is included for 100% shielding of RF radiation from the chamber
  • Max vacuum level: 1.0E-5 Torr with optional turbo pump and chamber baking
Sample Holder
  • Sample holder is a rotatable and heatable stage made of ceramic heater with stainless steel cover
  • Sample holder size: 50 mm Dia. for. 2″ wafer max
  • Rotation speed: 1-10 rpm adjustable for uniform coating
  • The holder temperature is adjustable from RT to 600 °C max (5 min max at 600 °C; 2 hr max at 500 °C) with accuracy +/- 1.0 °C via a digital temperature controller
Vacuum Pump
  • KF40 vacuum port is built in for connecting to a vacuum pump.
  • Vacuum level: 1.0E-2 Torr with included dual stage mechanical pump
Size 540 mm L×540 mm W×1000 mm H
Net Weight 60 kg
Warranty One years limited warranty with lifetime support.
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