NST Combinatorial plasma sputtering coater with 3 magnetron sputtering sources

• Three sputtering power sources are integrated into one control box.
  • DC source: 500 W power for coating metallic materials.
  • RF source: 300 W power, 13.56 MHz frequency for coating non-conductive materials.

• Three 2″ Magnetron Sputtering Heads with water cooling jackets and shutters are included.
• One Sputting Head Model also available.
  • Target size requirement: 2″ diameter
  • Thickness range: 0.1 – 5 mm for both metallic and non-conductive targets (including backing plate)
  • One Stainless Steel Target and one Research Grade Al2O3 target are included for demo testing
• Customized coater: Two DC – One RF; Two RF – One DC; Three DC; Three RF

• Vacuum chamber: 300 mm Dia.×300 mm Height, made of stainless steel
• Viewport: Two pieces of 100 mm Dia. glass. One fixed; one detachable for cleaning and replacement
• Hinged type lid with pneumatic power pole allows easy target change

• Sample holder is a rotatable and heatable stage made of ceramic heater with copper cover
• Sample holder size: 140 mm Dia. for. 4″ wafer max
• Rotation speed: 1 – 20 rpm adjustable for uniform coating
• The holder temperature is adjustable from RT to 500 °C max (2h max) with accuracy +/- 1.0 °C via a digital        temperature controller

• Two precision mass flow controllers (MFC) are installed to allow inlet of two types of gases
  • Flow rate: 0 – 200 mL/min & 0 – 100ml/min adjustable on the touch screen control panel
• Air inlet valve is installed for vacuum release

• A mobile pump station is included. The sputtering coater can be placed on top of station
• High-speed turbo pump at speed 80L/S is combined        with a two-stage mechanical pump (220 L/min) for max vacuum level and faster pumping speed
• Standard vacuum level connected with chamber : < 4.0E-5 Torr. .  (1.0E-6 Torr with chamber baking )

• • Refrigeration range: 5~35 °C
  • Flow rate: 16 L/min
  • Pump pressure: 14 psi

Lid open: 48″ × 28″ × 37″