NST-in-line magnetron sputtering system is used to deposit metal film (Al, Ag, Ni, Cu, Ti, Pd, etc.) on the surface of crystal silicon, and can realize reactive sputtering. It can complete magnetron sputtering process under high and low vacuum, and also has the ability to produce crystalline silicon photovoltaic film in various sizes and larg.
Programmable single chamber magnetron sputtering coater is widely used in semiconductor, LED, photovoltaic and other industries. It is mainly used for the preparation of various metal, semiconductor and dielectric materials thin film, and can meet the needs of scientific research and small batch production.
Dual-target NST magnetron sputtering coater is a cost-effective magnetron sputtering coating equipment independently developed by our company. It is standardized, modular and customizable. There are 1-inch or 2-inch magnetron targets for you to choose. Customers can choose the target according to the size of the substrate to be coated.
The NST-300-2HD dual target magnetron sputtering coater is equipped with two target guns, one weak magnetic target is used for sputter coating of non-conductive materials and one strong magnetic target is used for sputter coating of ferromagnetic materials.
Two zones CSS furnace with rotating wafer holder is an advanced rapid thermal processing furnace with 11″ OD quartz chamber and 5″×5″ rotating sample holder. It is designed for CSS (Close Spaced Sublimation) film coating up to 5″ circular or square wafer samples at working temperature of 800°C Max.
Three targets magnetron sputtering coater NST-MSP300S-2DC1RF 
NST Four sources thermal evaporating system 
NST-600-3HD three-target magnetron sputtering coater 
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