NST-in-line magnetron sputtering system is used to deposit metal film (Al, Ag, Ni, Cu, Ti, Pd, etc.) on the surface of crystal silicon, and can realize reactive sputtering. It can complete magnetron sputtering process under high and low vacuum, and also has the ability to produce crystalline silicon photovoltaic film in various sizes and larg.
NST-dual-head high vacuum magnetron plasma sputtering coater is a compact magnetron sputtering system with dual 2 target sources, e.g., one DC source for coating metallic film, and the other RF source for coating non-metallic material.
Two zones CSS furnace with rotating wafer holder is an advanced rapid thermal processing furnace with 11″ OD quartz chamber and 5″×5″ rotating sample holder. It is designed for CSS (Close Spaced Sublimation) film coating up to 5″ circular or square wafer samples at working temperature of 800°C Max.
Single target NST magnetron sputtering coater is a cost-effective magnetron sputtering coating equipment independently developed by our company. It is standardized, modular and customizable. The magnetron target head can be selected from 1 inch 2 inches 3 inches. Customers can choose the target according to the size of the substrate to be coated.
Single chamber magnetron sputtering system is mainly composed of sputtering vacuum chamber, magnetron sputtering target, substrate water-cooled heating platform, working gas path, air extraction system, vacuum measurement, electronic control system and installation machine.
Dual-Target Magnetron Sputtering Coater 
NST Combinatorial plasma sputtering coater with 3 magnetron sputtering sources 
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